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Acknowledgment to Reviewers of Microstructures

Published on: 5 Jan 2022 Viewed: 333

A rigorous and impartial peer-review process is essential for the publication on a full scale, which can help authors revise their papers timely and maintain a sound academic environment. Here, we would like to sincerely thank each and every reviewer who dedicated his or her time and professional skills to reviewing manuscripts for Microstructuresin 2021:


Name
Affiliation
Jiamian Hu
Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, USA.
Fuyang Tian
Institute for Applied Physics, University of Science and Technology Beijing, Beijing, China.
Wei Qiu
School of Mechanical Engineering, Tianjin University, Tianjin, China.
Yingchun Cheng
Institute of Advanced Materials, Nanjing Tech University, Nanjing, Jiangsu, China.
Yuan Huang
School of Physics, Beijing Institute of Technology, Beijing, China.
Toshihiko Yokoyama
Department of Material Molecular Science, Institute for Molecular Science, Okazaki, Japan.
Qilong Gao
International Laboratory for Quantum Functional Materials of Henan, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan, China.
Jun Zhong
Institute of Functional Nano & Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon-Based Functional Materials and Devices, Soochow University, Suzhou, Jiangsu, China.
Lianzhou Wang
Nanomaterials Centre, School of Chemical Engineering and Australian Institute for Bioengineering and Nanotechnology, The University of Queensland, Brisbane, QLD, Australia.
Haijun Yu
Institute of Advanced Battery Materials and Devices, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China.
Siqi Shi
School of Materials Science and Engineering, Shanghai University, Shanghai, China.
Xiaoxing Cheng
Department of Materials Science and Engineering, The Pennsylvania State University, Pennsylvania, USA.
Xiaolin Wang
Institute of Superconducting and Electronic Materials (ISEM), Australian Institute for Innovative Materials (AIIM), University of Wollongong, Wollongong, NSW, Australia.
Takao Mori
International Center for Materials Nanoarchitectonics (WPI-MANA), National Institute for Materials Science (NIMS), Ibaraki Prefecture, Japan.
Zibin Chen
School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, NSW, Australia.
Guohong Zou
College of Chemistry, Sichuan University, Chengdu, Sichuan, China.
Xing Zhou
State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan, Hubei, China.
Tao Li
Department of Chemistry and Biochemistry, Northern Illinois University, DeKalb, IL, USA.
Wenlei Zhu
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA, USA.
Shi Zhang Qiao
School of Chemical Engineering & Advanced Materials, The University of Adelaide, Adelaide, SA, Australia.
Chengzhou Zhu
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, Australia.
Mingxing Zhang
Department of Clinical Medicine and Surgery, Federico II University Medical School of Naples, Naples, Italy.
Bernd Gludovatz
School of Mechanical and Manufacturing Engineering, University of New South Wales , Sydney, NSW, Australia.
Nicola Morley
Department of Materials Science and Engineering, University of Sheffield, Sheffield, UK.
TAO YANG
Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
Wassila Sekkal
Univ. Lille, CNRS, INRAE, Centrale Lille, Lille, France.
Chunqiang Zhuang
Institute of Microstructure and Property of Advanced Materials, Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing, China.

Thank you all for providing professional review reports to journal submissions! To know more about preferential policies for journal reviewers, please contact our Editorial Office at editorialoffice@microstructj.com.

Respectfully Submitted by the Editorial Office
Microstructures


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